![]() ![]() Additionally, there are now 2 x 4 lane PCIe interfaces, most often used for M.2 storage devices. ![]() This means that a discrete GPU can be connected by 16 PCIe lanes or two GPUs by 8 PCIe lanes each. Īll Ryzen desktop processors feature 28 (24 + 4) PCIe 5.0 lanes. However, XMP memory profiles are still supported. ![]() It allows to encode a wider set of timings to achieve better performance and compatibility. Unlike Intel XMP, AMD EXPO is marketed as an open, license and royalty-free standard for describing memory kit parameters, such as operating frequency, timings and voltages. Additionally, Zen 4 supports new AMD EXPO SPD profiles for more comprehensive memory tuning and overclocking by the RAM manufacturers. On desktop and server platforms, Zen 4 supports only DDR5 memory, with support for DDR4 dropped. Zen 4 marks the first utilization of the 5 nm process for x86-based desktop processors. Zen 4's I/O die includes integrated RDNA 2 graphics for the first time on any Zen architecture. Previously, the I/O die on Zen 3 was built on GlobalFoundries' 14 nm process for Epyc and 12 nm process for Ryzen. Like its predecessor, Zen 4 in its Desktop Ryzen variants features one or two Core Complex Dies (CCDs) built on TSMC's 5 nm process and one I/O die built on 6 nm. Zen 4 powers Ryzen 7000 mainstream desktop processors (codenamed "Raphael") and will be used in high-end mobile processors (codenamed "Dragon Range"), thin & light mobile processors (codenamed "Phoenix"), as well as Epyc 9004 server processors (codenamed "Genoa" and "Bergamo"). It is the successor to Zen 3 and uses TSMC's N5 process for CCDs. Zen 4 is the codename for a CPU microarchitecture designed by AMD, released on September 27, 2022. ![]()
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